Xiaomi is preparing to release the Redmi K50 series as China prepares to celebrate the Lunar New Year. These models will be launched in February and will include a mix of high-end Dimensity and Snapdragon chipsets – but not at the same time. According to Lu Weibing, the Snapdragon 8 Gen 1 model will be released first, followed by the Dimensity 9000 model.
There is still some uncertainty about which models will receive which chips and a total of four phones are on the way – the Redmi K50, K50 Pro, K50 Pro+, and K50 Gaming.
According to current speculation, the two Pro models will be equipped with Qualcomm chips, a Snapdragon 8 Gen 1 for the Redmi K50 Pro+ and a Snapdragon 870 for the regular Pro.
The Redmi K50 is expected to be equipped with a new MediaTek chip known as the Dimensity 7000. (sometimes as the 8000). Unlike the Snapdragon 8 Gen 1 and the Dimensity 9000, early rumors indicate that this will be a 5 nm chip with no Cortex-X2 core (so four A78 and four A55) and a Mali-G510 MC6.
The K50 series will include MIUI 13, 50W charging for the base model, 120W charging for the Pros, a 108 MP camera, and a periscope. The Gaming model will retain its shoulder triggers and will likely be released in some regions as the next Poco F GT (Xiaomi also promises the best haptic engine yet).
