Xiaomi lately revealed the 12 and 12 Pro in China with new Snapdragon 8 Gen 1 chipsets, and the latest flagship is featured in a teardown video by WekiHome on Youtube. The teardown shows that the structure of the 12 Pro is structurally very “glass sandwich.”
After breaking the adhesive seal around the back of the glass, we can see the layout of the mainboard and camera cluster upwards, the battery in the middle, and the daughterboard below, which contains the charger and loudspeaker, and motor.
Many of the connectors, modules, cameras and connections to the daughterboard must be removed before the motherboard can come out. The Snapdragon 8 Gen 1
uses heat sink foil, copper foil, silicone grease, and a large VC thermal plate with a size of 2900 mm². The 12 Pro is the first mobile to launch with the Sony IMX 707 50 MP camera sensor, and the additional camera sensors include two 50 MP Samsung JN1 sensors. The primary camera uses a 7-part lens with OIS, while the others have a 5-part telephoto lens and a 6-part ultra-wide angle lens. The front camera of the mobile is a 32 MP shooter.
SK Hynix manufactures both the RAM and the memory modules on board with LPDDR5 or UFS 3.1. The teardown also revealed that the in-display scanner comprises a thinner and more expensive assembly. After all, the vibration motor should be comparable to the iPhone’s Taptic Engine.
The Xiaomi 12 Pro also has a 6.73-inch LTPO AMOLED screen. A 4,600 mAh battery can provide 120 W fast wired charging and 50 W fast wireless charging.
